| 000 | 00558nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aOmer, Ahmed _9782385 |
||
| 100 |
_aFlint, andrew _9782386 |
||
| 245 | 0 | _aTestability and Signal Integrity in a Low Cost Multichip Module | |
| 300 | _a300-307 p. | ||
| 650 |
_aElectronic Packaging _993323 |
||
| 650 |
_aInterconnects _9727595 |
||
| 650 |
_aLow Cost _9696426 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c746062 _d746062 |
||