| 000 | 00545nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aHan, Sejin _9777391 |
||
| 100 |
_aWang, K. K. _9694663 |
||
| 245 | 0 | _aStudy onPressurized Underfili Encapsulation of Flip Chips | |
| 300 | _a434-442 p. | ||
| 650 |
_aEncapsulant _9769985 |
||
| 650 |
_aFlip-Chip _9765290 |
||
| 650 |
_aPressurized Flow _9782100 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c745948 _d745948 |
||