| 000 | 00605nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aDecker, D. Richard _9780099 |
||
| 100 |
_aMysoor, Barayan Rangappa _9780100 |
||
| 100 |
_aTatikola, Ramani _9780101 |
||
| 245 | 0 | _aMultichip Mmic Package for X and Ka Bands | |
| 300 | _a27-33 p. | ||
| 650 |
_aComputer Modelilng _9696927 |
||
| 650 |
_aIc Packages _9771484 |
||
| 650 |
_aMicrowave Mesurements _9780104 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c745059 _d745059 |
||