| 000 | 00553nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aHauhe, Mark S. _9779478 |
||
| 100 |
_aWooldridge, John J. _9779480 |
||
| 245 | 0 | _aHigh Density Packaging of X-Band Active Array Modules | |
| 300 | _a279-291 p. | ||
| 650 |
_aActive Area _9734097 |
||
| 650 |
_aAluminum Nitride _9738735 |
||
| 650 |
_aFlip Chip _9765290 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744789 _d744789 |
||