| 000 | 00566nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1998 |||||||f |||| 00| 0 eng d | ||
| 100 |
_alin, Kwang -Lung _9768422 |
||
| 100 |
_aChao, Wen-Hsiuan _9778976 |
||
| 245 | 0 | _aMaterial Interactions of Solder Bumps Produced with Fluxless Wave Soldering | |
| 300 | _a59-64 p. | ||
| 650 | _aDiffusion | ||
| 650 |
_aSolder Bump Radius _9778977 |
||
| 650 |
_aWave Setup _9720186 |
||
| 773 |
_d1998 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744569 _d744569 |
||