| 000 | 00600nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1998 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aTan, Qing _9778955 |
||
| 100 |
_aSchaible, Brian _9777370 |
||
| 100 |
_aBond, Leonard J. _9343377 |
||
| 245 | 0 | _aThermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration | |
| 300 | _a53-58 p. | ||
| 650 |
_aFirst Law _9765460 |
||
| 650 | _aFinite - Element Analysis | ||
| 650 |
_aPrototyping _9755037 |
||
| 773 |
_d1998 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744560 _d744560 |
||