| 000 | 00640nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aSaitoh, Takehiro _9774400 |
||
| 100 |
_aToya, Masayuki _9778448 |
||
| 245 | 0 | _aNumerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material | |
| 300 | _a176-183 p. | ||
| 650 |
_aDelamination _9170371 |
||
| 650 | _aFinite - Element Analysis | ||
| 650 |
_aFracture _9162023 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744349 _d744349 |
||