| 000 | 00581nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aKeswick, Kathryn _9777355 |
||
| 100 |
_aGerman, Randy L. _9777356 |
||
| 100 |
_aNolan, Rich _9777357 |
||
| 245 | 0 | _aCompliant Bumps for Adhesive Flip-Chip Assembly | |
| 300 | _a503-510 p. | ||
| 650 |
_aCompliant Motion _9777358 |
||
| 650 |
_aFlip Chip _9765290 |
||
| 650 |
_aAssembly _9777359 |
||
| 773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743913 _d743913 |
||