| 000 | 00545nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aHuang, L. D _9774431 |
||
| 100 | _aHuang, Yue | ||
| 100 |
_aFeliow, Michael G. Pecht _9774434 |
||
| 245 | 0 | _aFili Pattern and Particle Distribution of Underfili Material | |
| 300 | _a493-498 p. | ||
| 650 |
_aCoefficient of Thermal Expansion (Cte) _9173906 |
||
| 650 |
_aUnderfili Processing _9768371 |
||
| 773 |
_d2004 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742654 _d742654 |
||