| 000 | 00561nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aKambe, Rokuro _9773427 |
||
| 100 |
_aTakda, Toshikatsu _9773428 |
||
| 100 |
_aKuroda, Masao _9773430 |
||
| 245 | 0 | _aMcm Substrate with High Capacitance | |
| 300 | _a23-27 p. | ||
| 650 |
_aThin Films _995175 |
||
| 650 |
_aMcm _9768358 |
||
| 650 |
_aCopper-Polyimide _9773431 |
||
| 773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742284 _d742284 |
||