| 000 | 00533nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aChang, Rong-Chong _9771482 |
||
| 100 |
_aYang, Wen-Hsien _9771483 |
||
| 245 | 0 | _aThree-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process | |
| 300 | _a200-209 p. | ||
| 650 |
_aFinite Volume _9756022 |
||
| 650 |
_aIc Packages _9771484 |
||
| 650 |
_aVof _9717168 |
||
| 773 |
_d2004 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c741511 _d741511 |
||