| 000 | 00523nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2002 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aQu, Jianmin _9770949 |
||
| 100 |
_aWong, C. P. _993201 |
||
| 245 | 0 | _aEffective Elastic Modulus of Underfili Material for Flip-Chip Applications | |
| 300 | _a53-65 p. | ||
| 650 |
_aEffective Width _9170751 |
||
| 650 |
_aFlip-Chip _9765290 |
||
| 650 |
_aMicromechanics _9102923 |
||
| 773 |
_d2002 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c741293 _d741293 |
||