| 000 | 00546nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1999 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aLau, John H. _95010 |
||
| 100 |
_aChang, Chris _9770033 |
||
| 245 | 0 | _aCharacterization of Underfili Materials Foer Functional Solder Bumped Flip Chips on Board Applications | |
| 300 | _a111-119 p. | ||
| 650 |
_aFlip Chip _9765290 |
||
| 650 |
_aPcb _9730622 |
||
| 650 |
_aUnderfili Processing _9768371 |
||
| 773 |
_d1999 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740927 _d740927 |
||