| 000 | 00510nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2002 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aWen, Shengmin _9769942 |
||
| 100 |
_aKeer, Leon M. _9769943 |
||
| 245 | 2 | _aA Constitutive Model for a High Lead Solder | |
| 300 | _a23-31 p. | ||
| 650 |
_aConstitutive Modelilng _9705163 |
||
| 650 |
_aMaterial Properties _9172216 |
||
| 650 |
_aPlasticity _986486 |
||
| 773 |
_d2002 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740887 _d740887 |
||