| 000 | 00572nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2001 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aHarries, Richard J. _9767962 |
||
| 100 |
_aSitaraman, Suresh K. _9767963 |
||
| 245 | 0 | _aNumerical Modeling of Interfacial Delamination Propagation in a Novel Peripheral Array Package | |
| 300 | _a256-264 p. | ||
| 650 |
_aDelamination _9170371 |
||
| 650 |
_aEnergy Release Rate _9171035 |
||
| 650 |
_aFracture Toughness _9170849 |
||
| 773 |
_d2001 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740142 _d740142 |
||