MRS Bulletin
Material type: Continuing resourceLanguage: English Analytics: Show analyticsPublication details: Warrendale, PA, U.S.A : Materials Research SocietyISSN:- 08837694
- 620
Item type | Current library | Collection | Shelving location | Call number | Vol info | Status | Notes | Date due | Barcode |
---|---|---|---|---|---|---|---|---|---|
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.06 (Jun. 2003) | Not For Loan | Monthly | S8133 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.05 (May. 2003) | Not For Loan | Monthly | S6931 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.04 (Apr. 2003) | Not For Loan | Monthly | S6926 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.03 (Mar. 2003) | Not For Loan | Monthly | S5656 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.02 (Feb. 2003) | Not For Loan | Monthly | S5655 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.28, No.01 (Jan. 2003) | Not For Loan | Monthly | S5654 | ||
Serials Collection | Periodical Section | Department of Mechanical Engineering | Periodical Section | Vol.27, No.12 (Dec. 2002) | Not For Loan | Monthly | S5653 |
Fullerence-Like Carbon Nitride: A Resilient Coaring Material by
Source: Mrs Bulletin
Material type: Article; Format:
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Availability: Items available for loan: Engr Abul Kalam Library (1).
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Microelectronics Packaging and Integration by
Source: Mrs Bulletin
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Chip-to-Module Interconnections Using "Sea of Leads " Technology by
Source: Mrs Bulletin
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Materials for 3d Packaging of Electronic and Optoelectronic Systems by
Source: Mrs Bulletin
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Emerging Materials Challenges in Microelectronic Pakaging by
Source: Mrs Bulletin
Material type: Article; Format:
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Packaging Options for Mems by
Source: Mrs Bulletin
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Low-Cost Water Level Vaccum Packaging Or Mems by
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Critical Aspects of High-Performance Microprocessor Packaging by
Source: Mrs Bulletin
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High-Performance Pakaging of PowerElectronics by
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Packaging Options for Mems Devices by
Source: Mrs Bulletin
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Single-Event Upsets in Microelectronics by
Source: Mrs Bulletin
Material type: Article; Format:
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Single-Event Upsets in Microelectronics:Fundamental Physics and Issues by
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Impact of Single-Event Upsets in Deep-Submicronsilicon Technology by
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Relations Between Basic Nuclear Data and Single-Event Upsets Phenomena by
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Circuit Responses to Radiation-Induced Upsets by
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Cosmic-Ray Neutrons onGround and InAtmosphere by
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total Ionizing Dose and Displacement-Damage Effects in Microelectronics by
Source: Mrs Bulletin
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Superhard Coating Materials by
Source: Mrs Bulletin
Material type: Article; Format:
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Stability of Nanometer-Thick Layers in Hard Coatings by
Source: Mrs Bulletin
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Large-Scale Manufacturing of Nanoscale Multilayered Hard Coatings Deposited By Cathodic Arc/Unbalanced Magnetron Sputtering by
Source: Mrs Bulletin
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Nanocomposite Hard Coatings for Wear Protection by
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Recent Advances in Cubic Boron Nitride Deposition by
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Superhard Ceramic Oxides by
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Silicon in All Its for ms 2001 David Turnbull Lecture by
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TestingFundamental Theories of Surface Dynamics 201 Mrs Medalist Presentation by
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Reverse Engineering: Learning from Proteins How to EnhancePerformance of Synthetic Nanosystems by
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Acient and Modern Steels and Laminated Composites Containing Steels by
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E-Mrs Issues Call for Papers for 20th Aniversary Meeting
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