Your search returned 3 results.

Results
		Development of Copper Wire Bonding Application Technology by Fujita, Kazuya Maeda, Takamichi Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Comparison of Copper and Gold Wire Bonding on Integrated Circuit Devices by Galioway, David P Burkhard, David J Khoury, Salim L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Glowing Contact Areas in Loose Copper Wire Connections by Navik, Gunnar Sundklakk, Hakon Kristensen, Roar Slttbak, Jarle Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search