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A New Face Down Bonding Technique Using a Low Melting Point Metal by
  • Saito, Masayuki
  • Mori, Miki
  • Hongu, Akinori
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Repair of Circuits by Laser Seeding and Constriction Induced Plating by
  • Gupta, Arunava
  • Chen, Julian
  • Hussey, Brian
  • Partridge, Julian P
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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