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New Micromachined Membrane Switches in Silicon Technology by
  • Hitmann, Kai
  • Schumacher, Axel
  • Lang, Walter
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
The Influence of Bounce Parameters onMake Erosion of Silver/Metal-Oxide Contact Materials by
  • Hetzmannseder, Engelbert
  • Rieder, Werner
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
The Energeticsof Gas Flow and Contact Erosion During Short Circuit Arcing by
  • Weaver, P. M
  • Pechrach, Kesorn
  • Mcbride, John W
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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