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Single Chamber Compact Two-Phase Heat Spreaders with Microfabricated Boiling Enhancement Structures by
  • Murthy, Sunil S
  • Joshi, Yogendra K
  • Nakayama, Wataru
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader by
  • Kalahasti, Srikaran
  • Joshi, Yogendra K
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
A Closed Form Solution of Junction to Substrate Thermal Resistance in Semiconductor Chips by
  • Masana, Francesc N
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Disk-Shaped Miniature Heat Pipe (Dmhp) with Radiating Micro Grooves for a to Can Laser Diode Package by
  • Chien, Hsin-Tang
  • Lee, Da-Sheng
  • Chen, Ping-Hei
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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