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		Novel Fabrication Process of Ain Ceramic Matrix Composites at Low Temperature by Nasery, Hesam Pugh, Martin Source: Science and Engineering of Composite Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mixed-Metal li3n-Based Systems for Hydrogen Storage: li3aln2 and li3fen2 by Langmi, HenrIETta W Culilgan, Scott D Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Density Packaging of X-Band Active Array Modules by Hauhe, Mark S Wooldridge, John J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Laser Trimming of Thick Film Metal Resistors on Aluminum Nitride Substrates by Kurihara, Yasutoshi Takahashi, Shigeru Yamada, Kazuji Endoh, Tsuneo Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages by Iwase, Nobuo Tsuge, Akihiko Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Titanium Nitride-Molybdenum Metalilzing Method for Aluminum Nitride by Asai, H Iwase, Nobuo Sato, H Kimura, K Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Design of Metalilzations and Components for Aluminum Nitride Packages for Vlsic by Dolhert, Leonard E Enloe, Jack H Luh, Elilce Y Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Prototype Packages in Aluminum Nitride for High Performance Electronic Systems by Sparrow, John A Lodge, Kevin J Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Bonding Mechanism Between Aluminum Nitride Substrate and Ag-Cu-Ti Solder by Kurihara, Yasutoshi Takahashi, Shigeru Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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