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A New Packaging Technology Using Micro-Solder Bumps for High-Speed Photoreceivers by
  • Hayashi, Tsuyoshi
  • Katsura, Kohsuke
  • Tsunetsugu, Hideki
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
An Innovative Bonding Technique for Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments by
  • Hayashi, Tsuyoshi
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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