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		Testability and Signal Integrity in a Low Cost Multichip Module by Omer, Ahmed Flint, andrew Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Per-Unit-Length Capacitance Matrix of Flaring Vlsi Packaging Interconnections by Omer, Ahmed Cangeliaris, andreas C Prince, John L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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