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		Effects of Filiers on Wire Sweep in Semiconductor Chip Encapsulation by Han, Sejin Wang, K. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Analysis OfFlow of Encapasulant During Underfili Encapsulation of Flip-Chips by Han, Sejin Wang, K. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Study onPressurized Underfili Encapsulation of Flip Chips by Han, Sejin Wang, K. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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