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		Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps by Chen, Chun-Jen lin, Kwang-Lung Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Material Interactions of Solder Bumps Produced with Fluxless Wave Soldering by lin, Kwang Lung Chao, Wen-Hsiuan Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Material Interactions of Solder Bumps Produced with Fluxless Wave Soldering by lin, Kwang -Lung Chao, Wen-Hsiuan Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders by Chen, Chun-Jen lin, Kwang Lung Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Microstructures and Mechanical Properties of Sn-8.55zn-0.45al-Xag Solders by Huang, C Lin, Kwang -Lung Source: Journal of Materials Research Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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