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		Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging by Luo, Shijian Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Uv/Ozone Treatment on Surface Tension and Adhesion in Electronic Pakaging by Luo, Shijian Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Surface Property of Passivation Layer on Integrated Circuit Chip and Solder Mask Layer on Printed Circuit Board by Luo, Shijian Wong, C. P Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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