Your search returned 4 results.

Results
		Encapsulant for Nonhermetic Multichip Packaging Applications by lin, A.W Wong, Ching-Ping Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Single Chip Versus Multichip Packaging Option for Digital Cmos In1990'S by Fililon, Raymond A Neugebauer, Constantine A Daum, Wolfgang Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Multichip Packaged Gaas 16x16 Paraliel Multiplier by Sekiguchi, T Hirose, T Nishiguchi, Masanori Sawada, Sosaku Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Bond Wireless Multichip Packaging Technology for High-Speed Circuits by Mahoney, Leonard J Chen, Chang-Lee Tsang, Dean Z Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search