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A New Chemorheological Analysis of Highly Filied Thermosets Used in Integrated Circuit Packaging by
  • Haliey, Peter J
Source: Journal of Applied Polymer Science
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Relationship Between Isothermal and Dynamic Cure of Thermosets ViaIsoconversion Representation by
  • Boukhili, R
  • Atarsia, A
Source: Polymer Engineering and Science
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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