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Electrothermal Simulations in Punchthrough and Nonpunchthrough Igbt'S by
  • Pendharkar, S
  • Trivedi, M
  • Shenai, K
Source: IEEE Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Equivalent Circuit Modeling of Static Substrate Thermal Coupling Using Vcvs Representation by
  • Walkey, David J
Source: Ieee Journal of Solid-State Circuits
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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