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		Material Interactions of Solder Bumps Produced with Fluxless Wave Soldering by lin, Kwang -Lung Chao, Wen-Hsiuan Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Soder Bump Size and Shape Modeling and Exprimental Validation by Pfeifer, M. J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Versatile Multilayer Mcm-D Structure for High Reliability Applications by Strandberg, Jan Weiland, anders Bodo, Peter Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Solder Bumper Formation Using Electroless Plating and Ultrasonic Soldering by Inaba, Michihiko Yamakawa, Koji Iwase, Nobuo Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Innovative Bonding Technique for Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments by Hayashi, Tsuyoshi Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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