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		Microfluidic Mems for Semiconductor Processing by Henning, Albert K Weber, Werner Zdebick, Mark Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Laser Drililng of Microvias in Epoxy-Glass Printed Circuit Boards by Kestenbaum, Ami D'Amico, J.F Blumenstock, Brent J Deangelo, M.A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling and Analysis of 96.5sn-3.5ag Lead-Free Solder Joints of Wafer Level Chio Scale Package on Buildup Microvia Printed Circuits Board by Lau, J Lee, Ricky Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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