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High Frequency Measurements and Simulations on Wire-Bonded Modules onSequential Build-Up Boaard Sbu'S by
  • Sihlbom, Rolf
  • Dernevik, Markus
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Cmos Aps Crosstalk Characterization Via A Unique Submicron Scanning System by
  • Pecht, Orly Yadid-
  • Shcherback, Igor
Source: Ieee Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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