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Influence of Process Parameter Variations onSignal Distribution Behavior of Wafer Scale Integration Devices by
  • Gneiting, Thomas
  • Jalowiecki, Ian P
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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The Facilitation of Insight for Analog Design. by
  • Spence, Robert
Source: Ieee Transactions on Circuits and Systems-Ii: Express Briefs ( for merly: Analog & Digital Signal Processing)
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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