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A Structured Testability Approach for Multi-Chip Modules Based on Bist and Boundary-Scan by
  • Zorian, Yervant
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Control and Definition Modularization an Improved Software Design Technique Technique for Organizing Programs by
  • Yadav, Surya B
Source: IEEE Transactions on Software Engineering
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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