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Esd Protection Design to Overcome Internal Damage on Interface Circuits of a Cmos Ic with Multiple Separated Power Pins by
  • Ker, Ming-Dou
  • Chang, Chyh-Yih
  • Chang, Yi-Shu
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Fracturesimulation Using An Elasto-Viscoplastic Virtual Internal Bond Model with Finite Elements by
  • Thiagarajan, Ganesh
  • Huang, Yonggang
Source: Transactions ofAsme, Journal of Applied Mechanics
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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