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		Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps) for Flip-Chip Applications by Jang, Kyung-Woon Kwon, Woon-Seong Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		NOnlinear Finite Element Simulation of Thermoviscoplastic Deformation of C4 Solder Joints in High Density Packaging Under Thermal Cycling by Hong, Bor Zen Burreli, lioyd G Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Intermetalilc Compounds onThermal Fatigue of Surface Mount Solder Joints by Tu, P, L Chan, Y. N Lai, J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Ir Microscopic Observation of Plastic Coated Tab Inner Lead Bonds Degrading During Thermal Cycling by Alpern, Peter Tilgner, Rainer Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Cycling Induced Plastic Deformation in Solder Joints. II. Accumulated Deformation in through Hole Joints by Pan, Tsung-Yi Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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