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Mcm Substrate with High Capacitance by
  • Kambe, Rokuro
  • Takda, Toshikatsu
  • Kuroda, Masao
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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3-D Electromagnetic Field Analysis of Interconnections in Copper-Polyimide Multichip Modules by
  • Sasaki, Shin-Ichi
  • Ohsaki, Takaaki
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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