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		Cu/Photosensitve-Bcb Thin-Film Multilayer Technology for High-Performance Multichip Modules by Shimoto, Tadanori Utsumi, K Matsui, K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Xception a Technique for Experimental Evaluation of Dependability in Modern Computers by Carreira, Joao Silva, Joao Gabriel Source: IEEE Transactions on Software Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Stan for d University President John Hennessy Began with A Machine That Played Tic-Tac-toe and Went on to Make Important Breakthroughs in Computer Design by Perry, Tekla S Source: Ieee Spectrum Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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