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		Efficient Calculation of Transient Temperature Fields Responding to Fast Changing Heatsoutces Over Long Duration in Power Electronic Systems by Gerstenmaier, Y C Wachutka, Gerhard K. M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Low-Cost Multichip Modules by Dobers, Michael Seyffert, Martin Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Quick Inspection of Power-Plane Short Fault on Multilayer Substrate by Chao, Fang-lin Wu, Ruey-Beei Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Substrate Thickness Optimization for liquid Immersion Cooled Silicon Multichip Modules by Azimi, Mehidi Jaeger, Richard C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Manufacturability of Capacitively Coupled Multichip Modules by Salzman, David B Knight, Thomas F Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cost-Effective Multichip Module Manufacture Using Passive Substrate Fault Tolerance by Peacock, Christopher Bolouri, H Habiger, C. M Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		State-Of-The-Art Multichip Modules for Avionics by Hagge, John K Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Advanced Ceramic Substrates for Multichip Modules with Multilevel Thin Film Interconnects by Tormey, Elien S Bachner, Frank J Foster, Brian C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		3-D Interconnection for Ultra-Dense Multichip Modules by Lemoine, Therry Val, Christian Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cost Saving Opportunities with Multichip Modules by Mavroides, Joanne Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Review of Planar Techniques for Multichip Modules by Schiltz, A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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