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		Wire-Bond Void Formation During High Temperature Aging by Chang, Hen Hsieh, Ker-Chang Yang, Albert Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Open Repair Technologies for Mcm-D by Wassick, Thomas A Economikos, Laertis Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Improvements in Wire Bonding and Solderability of Surface Mount Components Using Plasma Cleaning Techniques by Rust, Ray D Doane, Daryl Ann Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Transmission Electron Microscopy Study of Ultrasonic Wire Bonding by Krzanowski, James E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimal Wire-Sizing Function UnderElmore Delay Model with Bounded Wire Sizes by Lee, Y. M Source: Ieee Transactions on Circuits and Systems, I: Fundamental Theory and Applications Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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