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Immersion-Cooled Heat Sinks for Electronices Insight from High Speed Photography by
  • Bhavnani, Sushil H
  • Jaeger, Richard C
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
A Design Procedure for Displacement Ventilation (Part Two) by
  • Zhivov, Alexander
  • Nielsen, Peter
  • Riskowski, Gerald
Source: Hpac Heating/Piping/Air Conditioning
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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