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		Nickel/Paliadium Finish for Leadframes by Abbott, Donald C Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound by Cho, Soon-Jin Paik, Kyung-Wook Kim, Yong-Ju Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Sso Noise Electrical Performance limitations for Pqfp Packages by lin, L Prince, John L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Attachment Reliability Evaluation and Failure Analysis of Thin Smali Outline Packages (Tsop'S) with Alioy 42 Leadframes by Noctor, Donna M Bader, Franl E Foehringer, Richard Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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