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		Methodology for StudyingImpact of Intrinsic Stress onReliability OfElectroless Ni Ubm Structure by Micheli, J. A Guo, Yifan Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading by Saitoh, Takehiro Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		FindingRight Search Engine by Champeon, Steven Source: New.Architect: for merly Web Techniques Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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