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		An Automated Workceli for Meniscus Coating on 24-In Packaging Substraters by Bhattacharya, Swapan K Bhatevara, Sachin May, Gary S Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Clustered Yield Model for Smt Boards and Mcm'S by Tegethoff, Mick M. V Chen, T Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mcm Substrate with High Capacitance by Kambe, Rokuro Takda, Toshikatsu Kuroda, Masao Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thin Film Transfer Process for Low Cost Mcm-D Fabrication by Narayan, C Purushothaman, S Deutsch, A Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		320 Gb/S High-Speed Atm Switching System Hardware Technologies Based on Copper-Polyimide Mcm by Yamanaka, N Genda, Kouichi Sasaki, Shin-Ichi Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Characterization of Simultaneous Switching Noise for Multichip Modules by Ito, K Kato, K Hirano, Naohiko Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Elcectrical Design of an Mcm Package for a Multi-Processor Dirgital System by SARfaraz, Ali Swaminathan, Madhavan Bhatia, H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Minimal Ic Pretest Requirements for Multichip Modules by Daum, Wolfgang Burdick, Wililam E Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die by Ulrich, Richard K Rajan, Sanjay Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mcm-Ld: Large Area Processing Using Photosensitive-Bcb by Strandjord, andrew J. G Philip E., Garrou Tessier, Theodore G Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Delay and Reflection Noise Macromodeling for Signal Integrity Management of Pcbs and Mcms by Simovich, Slobodan Frazon, Paul Steer, Michael Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Advanced Copna-Resin as a Low Temperature Curing Resin for High-Density Electronic Packages by Nawa, Kazunari Ueda, Sakae Watanabe, Hideyuki Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Silicon-on-Silicon Field Programmable Multichip Module (Fpmcm) Integrating Fpga and Mcm Technologies by Darnauer, Joel Isshiki, T Maheshwari, B. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Early Analysis of Cost/Performance Trade-Offs in Mcm Systems by Garg, Vivek Stogner, Darreli J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling, Simulation, and Measurement of Mid-Frequency Simultaneous Switching Noise in Computer Systems by Becker, Wiren D Eckhardt, Jim Smith, Howard H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Performance Analysis of Mcm Systems by Truzzi, Claudio Beyne, Eric Ringoot, Edwin Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Compact liquid Cooling System for Smali, Moveable Electronic Equipment by Lee, T.Y. Tom andrews, James A Chow, Peter Saums, David Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interconnect Technologies andThermal Performance of Mcm by Ozmat, Burhan Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cost Saving Opportunities with Multichip Modules by Mavroides, Joanne Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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