Results of search for 'an:767028' › Engr Abul Kalam Library catalog

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		Analysis of Stratified Testing for Multichip Module Systems by Park, Nohpili Lombardi, Fabrizio Source: IEEE Transactions on Reliability Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling and Analysis of Multichip Module Power Supply Planes by Lee, Keunmyung Barber, Alan Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Example of a Mixed-Signal Global Positioning System (Gps) Receiver Using Mcm-L Packaging by Zabinski, Patrick J Gilbert, Barry K Kelier, T Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cu/Photosensitve-Bcb Thin-Film Multilayer Technology for High-Performance Multichip Modules by Shimoto, Tadanori Utsumi, K Matsui, K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electrical Characterization OfInterconnected Mesh Power System Imps Mcm Topology by Schaper, Leonard W Oldham, Danny R Low, Yee L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electrical Test of Multichip Substrates by Economikos, Laertis Morrison, Thomas Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Device Transfer Process Selectively Occupied Repeated Transfer Sort for Resource Saving Integration of Polymer Micro Optics Fabricated by Built in Mask Method by Yoshimura, Hana Arai, Yukihiko Asama, Kunihiko Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Characterization of Simultaneous Switching Noise for Multichip Modules by Ito, K Kato, K Hirano, Naohiko Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Minimal Ic Pretest Requirements for Multichip Modules by Daum, Wolfgang Burdick, Wililam E Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Power Cycling and Stress Variation in a Multichip Module by Sur, Biswajit Turlik, Lwona Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Chips-First Multichip Module Implementation of Passive and Active Test Coupons Utilizing Texas Instruments' High Density Interconnect Technology by Schaefer, Timothy M Kacines, Jeffrey J Gilbert, Barry K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling Intermediate Tests for Fault-Tolerant Multichip Module Systems by Kim, Sungsoo Lombardi, Fabrizio Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Economics Modeling of Multichip Modules Testing Stretegies by Abadir, Magdy Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		S Parameter-Based Experimental Modeling of High Q Mcm Inductor with Exponential Gradient Learning Algorithm by Zhao, Jian Frye, Robert C Tai, K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interation of Vapor Deposited Polyimide Into a Multichip Module Packaging Process by liberman, M.A Malba, Vincent Bernhardt, Anthony F Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Long Lossy lines (L3) and Their Impact Upon Large Chip Performance by Davidson, Evan E Mccredie, Bradley D Vilkelis, Valter V Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		New Photoimageable Dielectric Insulating Copolyester Thin Films: Synthesis and Characterization by Schneggenburger, lizabeth A Shi, Frank F Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermosonic Bonding of an Optical Transceiver Based on an 8×8 Vertical Cavity Surface Emitting Laser Array by Mclaren, Timothy S Kang, Sa Yoon Lee, Yung-Cheng Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Impedance and Crosstalk of Stripline and Microstrip Transmission lines by Rainal, A. J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Multilevel Epoxy Substrate for Flip-Clip Hybrid Multichip Module Applications by Okuno, A Tsunashima, EIIchi Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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Your search returned 23 results.