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		Stress Analysis of Functionaliy Graded Discs Under Mechanical and Thermal Loads: Analytical and Numerical Solutions by Bektas, Numan Behlul Akca, Mehmet Source: Science and Engineering of Composite Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Stress Analysis of Tape Automated Bonding Packages and Interconnections by Lau, John H Harkins, Girvin Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal-Stress Analysis with Electrical Equivalents by Riemer, Dietrich E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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