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		H2 Sensors Based on Wo3 Thin Films Activated by Platinum Nanoparticles Synthesized by Electroless Process by Zhang, Chao Yin, H Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		H2 Sensors Based on Wo3 Thin Films Activated by Platinum Nanoparticles Synthesized by Electroless Process by Zhang, Chao Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of a Carbon Paper-Supported Pd Catalyst for Pemfc Application by Oliveira, Mara Cristina L Alcaide, Francisco Alvarez, Garbine Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Synthesis of Ni-Activated Carbon Nanocomposites Via Electroless Deposition with out a Surface Pretreatment as Potential Hydrogen Storage Materials by Figueroa-Torres, M. Z Dominguez-Rios, C Cabarias-Moreno, J. G Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		In-Situ Patterned Intra-Anode Triple Phase Boundary in Sofc Electroless Anode: an Enhancement of Electrochemical Performance by Mukhopadhyay, M Mukhopadhyay, A Sharma, A. Das Basu, R.N Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Methodology for StudyingImpact of Intrinsic Stress onReliability OfElectroless Ni Ubm Structure by Micheli, J. A Guo, Yifan Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electroless Nickel/Copper Plating as a New Bump Metalilzation by Aschenbrenner, Rolf Reichl, H Simon, Jurgen Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Solder-Jetted Eutectic Pbsn Bumps for Flip-Chip by Baggerman, Antal F. J Schwarzbach, Daniel Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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