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		Ceramic-Polytetrafluoroethylene Composite Material-Based Miniaturized Split-Ring Patch Antenna by Habib Uliah, M Islam, Mohammad T Misran, N Source: Science and Engineering of Composite Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Pvc-Based Composite Material Containing Recycled Non-Metalilc Printed Circuit Board (Pcb) Powders by liu, Jingyang Guo, Yuwen Wang, Xinjie Qiao, Qi Source: Journal of Environmental Management Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Printed Microniductors on Flexible Substrates for Power Applications by Brandon, Erik J Kuhn, Wiliam B Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Flip Chip on Board Assessment of Reliability in Celiular Phone Application by Silianpaa, Markku Okura, Juscelino Hozumi Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fine line Thin Dielectric Circuit Board Characterization by Chang, Chi Shih Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Low Dielectric Material for Multilayer Printed Wiring Boards by Takahashi, A Nagai, Akira Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Monte Carlo Thermal Optimization of Populated Printed Circuit Board by Elperin, T Bar-Cohen, Avram Eliasi, Rami Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Area Distributed Soldering of Flexible and Rigid Printed Circuit Boards by Pelosi, W Clark, W.A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Semi-Analytical Method to Predict Printed Circuit Board Package Temperatures by Funk, John N Menguc, M. Pinar Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Laser Drililng of Microvias in Epoxy-Glass Printed Circuit Boards by Kestenbaum, Ami D'Amico, J.F Blumenstock, Brent J Deangelo, M.A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Information Model for a Cam Data Base to Support Flexible Manufacture of Printed Circuit Boards by Whelan, Peter T Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Density Multilayer Printed Circuit Board for Hitac M-880 by Takahashi, A Nagai, Akira Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Ink-Jet-Deposited Passive Component Process for Rfid by Redinger, David Molesa, Steve Source: Ieee Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Partial Discharge Testing of Solder Fillets onpcbs in A Partial Vacuum: New Experimental Results by Capineri, Lorenzo Dainelli, Gabriele Materassi, Maurizio Dunn, Barrie D Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of Pulse Plating Parameters on Copper Plating Distribution of Microvia Pcb Manufacture by Yung, K C Yu, T.M Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Review Options, Such As Immersion Tin, Immersion Silver, Electroless Nickel/Immersion Gold, and Immersion Gold Over Copper As Final Finishes for Printed Circuit Boards by Et Al, Walsh, D. E Source: Metal Finishing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Integrated Micro Cooling System for Electronic Circuits by Schutze, J Iigen, H Fahrner, W. R Source: IEEE Transactions on Industrial Electronics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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