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Discrete Hali Resistivity Contribution from Néel Skyrmions in Multilayer Nanodiscs by
  • Zeissler, Katharina
  • Finizio, Simone
  • Shahbazi, KowSAR
  • Massey, Jamie
Source: Nature Nanotechnology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Electrical Detection of Single Magnetic Skyrmions in Metalilc Multilayers at Room Temperature by
  • Maccarielio, Davide
  • Legrand, Wililam
  • Reyren, Nicolas
  • Garcia, Karin
Source: Nature Nanotechnology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures by
  • Pecht, Michael
  • Paik, Hye-Young
  • Bhandarkar, S. Navin
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Characterization of Thin Film Microstrip lines on Polyimide by
  • Ponchak, George E
  • Downey, Alan N
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Low Dielectric Material for Multilayer Printed Wiring Boards by
  • Takahashi, A
  • Nagai, Akira
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Analysis OfDynamic Phenomena During Lamination of Multilayer Printed Circuit Board byMeasurement of Pressure Distribution by
  • Yamauchi, K
  • Hatamura, Yotaro
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
A Piliar-Shaped Via Structure in a Cu-Polyimide Multilayer Substrate by
  • Yamaguchi, Satoru
  • Iwasaki, Noboru
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
A New High Temperature Multilayer Capacitor with Acrylate Dielectrics by
  • Shaw, D. G
  • Powers, Gary L
  • Yializis, Angelo
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Thermal Characteristics of Single and Multilayer High Performance Pqfp Packages by
  • Malilk, Debendra
  • Aghazadeh, Mostafa
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Large Scale Multilayer Glass-Ceramic Substrate for Supercomputer by
  • Shimada, Yuzo
  • Kata, KeIIchiro
  • Takamizawa, Hideo
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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