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		Benchmark Equations for Determination of Main Parameters of Fracture Mechanics by Ranjbaran, Abdolrasoul Source: NED University Journal of Research Formerly NED University Journal of Engineering Research Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Comparison of Moment-Curvature Models for Fiber-Reinforced Polymer Plate-End Debonding Studies Using Global Energy Balance Approach by Guan, Garfield X Source: ACI Structural Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Determination OfCritical Load and Energy Release Rate in Mode II Delamination Using a Meshfree Method by HeSAR, Goudarz Ghanizadeh Pekbey, Yeliz Yildiz, Hasan Source: Science and Engineering of Composite Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Mesh-Free Simulation on Model I Delamination of Composite Structures by HeSAR, Goundarz Ghanizadeh Hildiz, Hasan Maleiki, Farshid Khosravi Pekbey, Yeliz Source: Science and Engineering of Composite Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Modeling of Interfacial Delamination Propagation in a Novel Peripheral Array Package by Harries, Richard J Sitaraman, Suresh K Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load by Wang, Jianjun liu, Shengyi Zou, Daqing Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High-Speed Fracture Studies on Bimatrial Interfaces Using Photoelasticity---A Review by Shukla, A Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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